Transient analysis of the impact stage of wirebonding on Cu/low-K wafers

Microelectronics Reliability

Volumn 45, Issue 2, 2005, Pages 371-378

  Yeh, Chang Lin ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DEFECTS; DIELECTRIC MATERIALS; ELASTIC MODULI; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; PASSIVATION; SILICA; TRANSIENTS; VLSI CIRCUITS; WIRE;

INTERMETALLIZATION DIELECTRIC (IMD) MATERIALS; STRUCTURAL DEFECTS; TRANSIENT ANALYSIS; WIREBONDING;

BONDING;

EID: 11344284203     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.04.026     Document Type: Conference Paper

References (9)

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