Effect of ultrasonic frequency on fine pitch aluminum wedge wirebond

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1078-1087

  Gonzalez, Bill ^a   Knecht, Sheera ^a   Handy, Howard ^a   Ramirez, Jose ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; ELECTRIC WIRE; STRENGTH OF MATERIALS; TENSILE STRENGTH; TRANSDUCERS; ULTRASONIC EFFECTS;

ALUMINUM WEDGE BONDS; BOND WIDTH; INITIAL BOND FORCE; ULTRASONIC FREQUENCY; WIRE PULL LIFTS; WIRE PULL STRENGTH; WIRE TENSILE STRENGTH;

ELECTRONICS PACKAGING;

EID: 0029705608     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)