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Volumn , Issue , 2001, Pages 379-385
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A new approach to the robust wirebonding
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NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
AUGER ELECTRON SPECTROSCOPY;
KINETIC ENERGY;
MICROPROCESSOR CHIPS;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTING SILICON;
SHRINKAGE;
THERMAL DIFFUSION;
ROBUST WIREBONDING;
ELECTRONICS PACKAGING;
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EID: 0035019042
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (6)
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References (3)
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