Analysis and application of vibration behaviour for wirebonding capillary by transmission laser vibrometer

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 72-75

  Tamura, Y ^a   Miyahara, Y ^b   Suzuki, H ^c  

^a Semiconduct Syst Eng Center   (Japan)

^b Oita Works   (Japan)

^c TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; ULTRASONIC APPLICATIONS;

CALIBRATION SYSTEM; LASER VIBROMETERS; REAL TIME ACQUISITION; ULTRASONIC MONITORING; ULTRASONIC OSCILLATORS; VIBRATION AMPLITUDE; VIBRATION BEHAVIOURS; VIBRATION CHARACTERISTICS; VIBRATION MODES; WIREBONDING;

VIBRATION ANALYSIS;

EID: 84970888882     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731030     Document Type: Conference Paper

References (1)

1. H. Suzuki T. Tonedachi Calibration System of Wire Bonder using Laser Displacement Sensor Proceedings of The 44th· Spring Meeting, The Japan Society of Applied Physics and Related Societies Proceedings of The 44th· Spring Meeting, The Japan Society of Applied Physics and Related Societies 1997