Over 20 GHz microwave frequency model of fine pitch ball grid array (FPBGA) bonding

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2000, Pages 111-114

  Lee, Junho ^a   Ahn, Seungyoung ^a   Ryu, Jaeyoung ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; MICROWAVE CIRCUITS;

BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0034512533     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)