Thermomechanical models for leadless solder interconnections in flip chip assemblies

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 1, 1998, Pages 177-184

  Vandevelde, Bart ^a,b   Christiaens, Filip ^c   Beyne, Eric ^b   Roggen, Jean ^b   Peeters, Joris ^c   Allaert, Koen ^c   Vandepitte, Dirk ^d   Bergmans, Jan ^d  

^a IEEE   (Belgium)

^b IMEC   (Belgium)

^c LUCENT TECHNOLOGIES   (United States)

^d UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Analytical model; Flip chip assemblies; Solder joints; Structural design optimization; Thermomechanical induced stresses

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; OPTIMIZATION; SOLDERED JOINTS; THERMAL STRESS;

LEADLESS SOLDER INTERCONNECTION SYSTEMS; THERMOMECHANICAL MODELS;

FLIP CHIP DEVICES;

EID: 0032026984     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.679047     Document Type: Article

References (7)

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