Wideband scalable electrical model for microwave/millimeter wave flip chip interconnects

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 3, 2001, Pages 255-259

  Staiculescu, Daniela ^a,b   Sutono, Albert ^a,b   Laskar, Joy ^a,c  

^a IEEE   (United States)

^b RE Solutions   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Flip chip; Lumped element model; Regression model; Scalable model

Indexed keywords

LUMPED ELEMENT MODELS; MICROWAVE FLIP CHIP INTERCONNECTS; MILLIMETER WAVE FLIP CHIP INTERCONNECTS; REGRESSION MODELS; WIDEBAND SCALABLE ELECTRICAL MODEL;

COMPUTER SIMULATION; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; MICROWAVE INTEGRATED CIRCUITS; MILLIMETER WAVE DEVICES; REGRESSION ANALYSIS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0035421211     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.938291     Document Type: Article

References (8)

1. 60-GHz flip chip assembled MIC design considering chip-substrate effect
2. An accurate equivalent circuit model of flip chip and via interconnects
3. Millimeter-wave characteristics of flip chip interconnects for multichip modules
4. Design rule development for microwave flip chip applications
5. Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip-chips
6. LRM probe-tip calibrations using non-ideal standards