Enhancing moisture resistance of PBGA

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 930-935

  Teo, Yong Chua ^a   Wong, Ee Hua ^a   Lim, Thiam Beng ^a   Yang, Yu Chuan ^b   Ju, Jin Han ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b Hewlett Packard Singapore (Private) Limited   (Singapore)

^c Kolam Ayer Industrial Park   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; MOLDS; NETWORK COMPONENTS; PACKAGING MATERIALS; ABSORPTION; BOND STRENGTH (MATERIALS); MOISTURE; PLASTIC MOLDS; PLASTICS APPLICATIONS; SHEAR STRENGTH;

DIE-ATTACH MATERIALS; MATERIAL COMBINATION; MOISTURE ABSORPTION PROPERTY; MOISTURE PERFORMANCE; MOISTURE RESISTANCE; MOISTURE SENSITIVITY; PACKAGE RELIABILITY; POPCORN FAILURE;

MOISTURE; ELECTRONICS PACKAGING;

MOISTURE RESISTANCE; PLASTIC BALL GRID ARRAYS (PBGA);

EID: 0031620347     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678820     Document Type: Conference Paper

References (5)

1. George Hawkins, Gans Ganesan, Gary Lewis, Howard Berg, "The PBGA: A systematic study of moisture resistance", The International Journal of Microcircuits and Electronic Packaging, Vol. 18, No. 2 (1995), pp. 122-132.
2. Kim S, "The role of plastic package adhesion in IC performance", Proc 41st Electronic Components and Technology Conf, May 1991.
3. Chun D S, Doane D A, "Reduction of popcorning in BGAs by plasma cleaning", 2nd Pan Pacific Microelectronics Symposium, Jan 1997.
4. Cui C Q, Chakravorty K K, Lim T B, "Adhesion enhancement in BGA packaging", The 2nd international symposium on electronic packaging technology, Shanghai, China, Dec 1996.
5. Wong E H, Lim T B, Teo Y C, "Moisture diffusion and delamination modeling of PBGA", To be published in 48 ECTC, 1998.