Reliability of PBGA assemblies under out-of-plane vibration excitations

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 2, 2002, Pages 293-300

  Yang, Q J ^a   Wang, Z P ^a   Lim, G H ^b   Pang, John H L ^b   Yap, F F ^b   Lin, R M ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electronic packaging; Plastic ball grid array (PBGA); Reliability; Vibration

Indexed keywords

CRACKS; FAILURE ANALYSIS; FREQUENCIES; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; VIBRATION MEASUREMENT;

VIBRATION EXCITATION;

PRINTED CIRCUIT BOARDS;

EID: 0036613726     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.1010020     Document Type: Article

References (16)

1. The 'smeared' property technique for the vibration analysis of printed circuit cards
2. Random vibration response of a surface mount lead/solder joint
3. Random vibration analysis of a printed wiring board with electronic components
4. PWB solder joint life calculation under thermal and vibration loading
5. Estimating the vibration fatigue life of quad leaded surface mount components
6. Vibration induced fatigue life estimation of corner leads of peripheral leaded components
7. Vibration fatigue of leadless chip carrier solder joints
8. Vibrational fatigue of surface mount solder joints
9. High- and low-cycle fatigue characteristics of leadless chip carrier solder joints
10. Solder joint reliability of surface mount connectors
11. Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions
12. Shock and vibration of solder bumped flip chip on organic coated copper boards