Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Volumn , Issue , 2003, Pages 335-340

  Wunderle, B ^a   Auersperg, J ^a,b   Grosser V ^a   Kaulfersch, E ^a,b   Wittler, O ^c   Michel, B ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Electronic packaging thermal management; Electronics packaging; Fatigue; Finite element methods; Microelectronics; Micromechanical devices; Rapid thermal processing; Thermal management; Thermomechanical processes; Virtual prototyping

Indexed keywords

EID: 84945910180     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2003.1287063     Document Type: Conference Paper

References (23)

1. H. Reichl, A. Schubert, and M. Töpper. Reliability of Flip-Chip and Chip Size Package. Microelectronics Reliability, (40): 1243-1254, 2000.
2. J.H. Lau and Y. Pao. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. Mc Graw-Hill, 1997.
3. H. Reichl, B. Michel, and A. Schubert. Materials Science and Engineering - A Major Topic in the Future of Microelectronic Packaging. Proc. 3. Int. Conf. Micromaterials, pages 72-73, April 17-19 2000.
4. A. Syed. Predicting Solder Joint Reliability for Thermal, Power & Bend Cycle within 25 % Accuracy. Proc. 51. Electronic Components and Technology Conference, pages 255-265, 2001.
5. H. Walter, W. Schneider, R. Dudek, E. Auerswald, and A. Schubert. Evaluation of Glob Top Materials for Chip-on-Board COB Applications. Proc. 3. Int. Conf. on Micro Materials, pages 1269-1271, April 17-19 2000. Berlin, Germany.
6. L.J. Ernst. Polymer Material Characterisation and Modeling. Proc. 1st EuroSimE Conf., Eindhoven, NL, pages 37-58, 2000.
7. O. Wittler, P. Sprafke, H. Walter, A. Gollhardt, D. Vogel, and B. Michel. Time and Temperature Dependent Mechanical Characterization of Polymers for Microsystems Applications. In Proceedings: Materials Week 2000 München, Germany, 25-28 Semptember 2000.
8. A. Schubert, R. Dudek, J. Auersperg, D. Vogel, B. Michel, and H. Reichl. Thermo-Mechnical Reliability Analysis of Flip-Chip Assemblies by Combined Microdac and Finite Element Method. Conf. Proc. Interpack '97, Hawaii, USA, pages 1647-1654, 1997.
9. R. Dudek, A. Schubert, and B. Michel. Thermo-Mechanical Reliability of Microcomponents. Proc. 3. Int. Conf. on Micromaterials, 206-213, April 17-19, Berlin, Germany 2000.
10. R. Darveaux and K. Banerji. Ball Grid Array Technologies, chapter 13. Mc Graw- Hill, New York, USA, 1995. Edited by J.H. Lau.
11. G. Gross. Bruchmechanik. Springer Verlag, Berlin, Germany, 2 edition, 1996.
12. J. Auersperg, A. Schubert, D. Vogel, B. Michel, and H. Reichl. Fracture and Damage Evaluation in Chip Scale ackages and Flip-Chip Assemblies by FEA and MicroDAC. Application of Fracture Mechanics in Electronic Packaging, 20:133-138, 1997.
13. L.F. Coffin. A Study of the Effects of Cyclic Thermal Stresses on a Ductile Material. Trans. ASME, 76:931-950, 1954.
14. S.S. Manson. Behaviour of Materials under Condition of Thermal Stresses. NACA TN-2933, Report 1170, pages 317-350, 1954.
15. A. Schubert, R. Dudek, B. Michel, and H. Reichl. Package Reliability Studies by Experimental and Numerical Analysis. Proc. 3. Int. Conf. on Micromaterials, pages 110-119, April 17-19, Berlin, Germany 2000.
16. P.L. Hacke, A.F. Sprecher, and H. Conrad. Thermomechanical Fatigue of 63Sn-37Pb Solder Joints, chapter 15, pages 466-499. van Nostrand Reinold, NY, USA. In: Thermal Stress and Strain in Microelectronic Packaging, edited by J.H. Lau
17. B. Wunderle, W. Nüchter, A. Schubert, B. Michel and H. Reichl. Parametric FE-Approach to Flip-Chip Reliability under various Loading Conditions. To be published in the Journal of Electronic Packaging, 2002.
18. B. Wunderle. Thermo-Mechanical Reliability of Flip-Chip Assemblies with Heat-Spreaders. PhD-Thesis, Technical University of Berlin, Germany, to be published, 2002.
19. K. Amiri Jam; V. Großer; V. Hillmann; F. Luczak; F. Schindler-Saefkow: Modular Microsystems. IZM Annual Report, Berlin 2002, 59-62
20. Arbeitsgemeinschaft MATCH-X: VDMA-Einheitsblatt 66305. Bausteine und Schnittstellen der Mikrotechnik. Frankfurt/M. 2002, 185 p.
21. J. Vogel, E. Kaulfersch, J. Auersperg, and K. Kreyssig. FE-Analyse zum thermischen Strukturverhalten von gestackten MATCH-X-Systemen. 47. Internationales Wissenschaftliches Kolloquium, Technische Universität Ilmenau, Germany, pages 677-678, September 23-26 2002.
22. E.F. Rybicki and M.F. Kanninen. A finite element calculation of stress intensity factors by a modified crack closure integral. Engineering Fracture Mechanics, Vol. 9, 1977, pp. 931-938
23. rd international Workshop: Thin Semiconductor Devices -Manufacturing and Applications, Nov. 25-26, 2002. Forum Hotel, Munich, Germany.