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Volumn 39, Issue 10, 1999, Pages 803-809

Thermal contact conductance across filled polyimide films at cryogenic temperatures

Author keywords

[No Author keywords available]

Indexed keywords

HEAT RESISTANCE; INTERFACES (MATERIALS); LOW TEMPERATURE EFFECTS; POLYIMIDES; PRESSURE EFFECTS;

EID: 0033207251     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0011-2275(99)00095-8     Document Type: Article
Times cited : (33)

References (13)
  • 1
    • 0024106462 scopus 로고
    • Recent developments in contact conductance heat transfer
    • Fletcher LS. Recent developments in contact conductance heat transfer. J Heat Transfer 1988;110:1059.
    • (1988) J Heat Transfer , vol.110 , pp. 1059
    • Fletcher, L.S.1
  • 2
    • 85003325390 scopus 로고
    • A review of thermal contact conductance of junctions with metallic coatings and films
    • AIAA Paper 92-0709. Reno, NV
    • Lambert MA, Fletcher LS. A review of thermal contact conductance of junctions with metallic coatings and films. In: AIAA 30th Aerospace Meeting, AIAA Paper 92-0709. Reno, NV, 1992.
    • (1992) In: AIAA 30th Aerospace Meeting
    • Lambert, M.A.1    Fletcher, L.S.2
  • 3
    • 0342295199 scopus 로고
    • Design and performance of low-thermal-resistance, high-electrical-isolation heat intercept connections
    • Niemann R., Gonczy C., Phelan J., Nicol D. Design and performance of low-thermal-resistance, high-electrical-isolation heat intercept connections. Cryogenics. 35:1995;829.
    • (1995) Cryogenics , vol.35 , pp. 829
    • Niemann, R.1    Gonczy, C.2    Phelan, J.3    Nicol, D.4
  • 4
    • 0342295198 scopus 로고    scopus 로고
    • Thermal resistance across a copper Kapton Copper/Kapton/Copper interface at cryogenic temperatures
    • Zhao L., Phelan P., Niemann E., Weber R. Thermal resistance across a copper Kapton Copper/Kapton/Copper interface at cryogenic temperatures. Advances in Cryogenic Engineering. 43:1998;1359-1367.
    • (1998) Advances in Cryogenic Engineering , vol.43 , pp. 1359-1367
    • Zhao, L.1    Phelan, P.2    Niemann, E.3    Weber, R.4
  • 6
    • 84965515012 scopus 로고
    • Thermal conductivity of a polyimide film between 4.2 and 300 K, with and without alumina particles as filler
    • NIST
    • Rule DL, Smith DR, Sparks LL. Thermal conductivity of a polyimide film between 4.2 and 300 K, with and without alumina particles as filler, NISTIR 3948, NIST, 1995:40.
    • (1995) NISTIR 3948 , pp. 40
    • Rule, D.L.1    Smith, D.R.2    Sparks, L.L.3
  • 7
    • 0026817829 scopus 로고
    • Thermal contact conductance of metallic coated BiCaSrCuO superconductor/copper interfaces at cryogenic temperature
    • Ochterbeck J., Peterson M., Fletcher G. Thermal contact conductance of metallic coated BiCaSrCuO superconductor/copper interfaces at cryogenic temperature. J. Heat Transfer. 114:1992;21.
    • (1992) J. Heat Transfer , vol.114 , pp. 21
    • Ochterbeck, J.1    Peterson, M.2    Fletcher, G.3
  • 10
    • 85008308411 scopus 로고
    • A review of thermal control materials for metallic junctions
    • Fletcher L. A review of thermal control materials for metallic junctions. J. Spacecraft Rockets. 9(12):1972;849-850.
    • (1972) J. Spacecraft Rockets , vol.9 , Issue.12 , pp. 849-850
    • Fletcher, L.1
  • 12
    • 0029235549 scopus 로고
    • A thermo-mechanical fatigue analysis of high density interconnect vias
    • Prabhu A., Barker S., Pecht D. A thermo-mechanical fatigue analysis of high density interconnect vias. Advances in Electronic Packaging ASME EEP. 10-1(10):1995;187-216.
    • (1995) Advances in Electronic Packaging ASME EEP , vol.101 , Issue.10 , pp. 187-216
    • Prabhu, A.1    Barker, S.2    Pecht, D.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.