Wafer level self-packaged infrared microsensors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5406, Issue PART 2, 2004, Pages 473-482

  Mahmood, Aamer ^a   Dave, Aasutosh ^a   Çelik Butler, Zeynep ^a   Butler, Donald P ^a  

^a UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

Author keywords

Distributed sensors; Smart skin; Uncooled IR detection; Wafer level packaging

Indexed keywords

BOLOMETERS; COMPUTER SIMULATION; ELECTRIC POTENTIAL; ENCAPSULATION; HIGH TEMPERATURE EFFECTS; INFRARED RADIATION; POLYIMIDES; SENSORS; SILICON WAFERS; SUBSTRATES; THERMAL CONDUCTIVITY; YTTRIUM BARIUM COPPER OXIDES;

DISTRIBUTED SENSORS; SMART SKIN; UNCOOLED IR DETECTION; WAFER-LEVEL PACKAGING;

MICROSENSORS;

EID: 10044272207     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.542680     Document Type: Conference Paper

References (7)

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2. A. Mahmood, S. Dayeh, D. P. Butler, Z. Celik-Butler, & quot;Micromachined Infrared Sensor Arrays on Flexible Polyimide Substrates", IEEE Sensors 2003, pp 777-782, Toronto, Canada, 2003.
3. A. Yildiz, Z. Celik-Butler and D. P. Butler, & quot;Microbolometers on a Flexible Substrate for Infrared Detection", IEEE Sensors Journal, 4, pp. 112-117, 2004.
4. A. Yaradanakul, D. P. Butler and Z. Celik-Butler, & quot;Uncooled Infrared Microbolometers on a Flexible Substrate", IEEE Transactions on Electron Devices, 49, pp. 930-933, 2002.
5. Y. T. Cheng, K. Najafi, C. T. Nguyen and L. Lin, & quot;Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding", Journal of Microelectromechanical Systems, 2, pp. 556-565, 2002.
6. B. Lee, S. Seok and K. Chun, & quot;A study on wafer level vacuum packaging for MEMS devices", Journal of Micromechanics and Microengineering, 13, pp. 663-669, 2003.
7. K. R. Williams, K. Gupta and M. Wasilik, & quot;Etch Rates for Micromachining Processing-Part II", Journal of Microelectromechanical Systems, 12, pp.761-778, 2003.