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Volumn , Issue , 1998, Pages 39-43
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Integrated magnetic-semiconductor components
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CHIP SCALE PACKAGES;
MAGNETIC SEMICONDUCTORS;
INTEGRATED MAGNETIC;
INTEGRATED PACKAGES;
MANUFACTURABILITY;
PACKAGING TECHNIQUES;
PLASTIC ENCAPSULATION;
POWER SEMICONDUCTORS;
SEMICONDUCTOR COMPONENTS;
THERMAL PERFORMANCE;
PACKAGING;
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EID: 0012619793
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IWIPP.1998.722249 Document Type: Conference Paper |
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Times cited : (2)
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References (0)
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