Solder bars - a novel flip chip application for high power devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 697-701

  Elenius, Peter ^a   Yang, Hong ^a   Benson, Roger ^a  

^a Flip Chip Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTROMIGRATION; RELIABILITY; SERVICE LIFE; SOLDERED JOINTS; TEMPERATURE;

FLIP CHIP SOLDER BUMPS; FLIP CHIP TECHNOLOGY; SOLDER BARS;

FLIP CHIP DEVICES;

EID: 0034482894     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)