Low temperature fabrication and characterization of integrated packaging-compatible, ferrite-core magnetic devices

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 1997, Pages 361-367

  Park, Jae Y ^a   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MAGNETIC CORES; POWER CONVERTERS;

INTEGRATED INDUCTORS; ORGANIC ELECTRONIC PACKAGING;

FERRITE DEVICES;

EID: 0030811444     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)