Long term noise measurements and median time to failure test for the characterization of electromigration in metal lines

Microelectronics Reliability

Volumn 39, Issue 11, 1999, Pages 1691-1696

  Ciofi, C ^a   Dattilo, V ^b   Neri, B ^b   Foley, S ^c   Mathewson, A ^c  

^a INFM   (Italy)

^b UNIVERSITY OF PISA   (Italy)

^c UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; ELECTROMIGRATION; FAILURE ANALYSIS; SPURIOUS SIGNAL NOISE;

MEDIAN TIME TO FAILURE (MTF) TESTS;

MICROELECTRONICS;

EID: 0033221986     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00174-2     Document Type: Article

References (11)

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