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Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 21, Issue 6, 2003, Pages 2482-2486

Mitigation of residual film stress deformation in multilayer microelectromechanical systems cantilever devices

(6) Pulskamp, Jeffrey S a Wickenden, Alma a Polcawich, Ronald a Piekarski, Brett a Dubey, Madan a Smith, Gabe b

a U S ARMY RESEARCH LABORATORY (United States)

b NAVAL SURFACE WARFARE CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL GEOMETRY; DEPOSITION; ELASTIC MODULI; ELASTICITY; ELECTRODES; INTEGRATION; MICROMACHINING; MULTILAYERS; RESIDUAL STRESSES; SILICON WAFERS; SOL-GELS; STIFFNESS; STRUCTURE (COMPOSITION); TENSILE TESTING; THIN FILMS;

LASER WAFERS; RESIDUAL FILM STRESS;

MICROELECTROMECHANICAL DEVICES;

EID: 0942267565 PISSN: 10711023 EISSN: None Source Type: Journal
DOI: 10.1116/1.1615982 Document Type: Article

Times cited : (46)

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