Planarity of large MEMS

Journal of Microelectromechanical Systems

Volumn 5, Issue 2, 1996, Pages 79-97

  Saif, M T A ^b,c,d,e   MacDonald, N C ^{a,b,f,g,h,i,j,k}  

^a IEEE

^b Cornell University   (United States)

^c Department of Obstetrics Gynecology

^d WASHINGTON STATE UNIVERSITY   (United States)

^e BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^f UNIVERSITY OF CALIFORNIA   (United States)

^g ROCKWELL SCIENCE CENTER   (United States)

^h Phys Electronics Industries Inc

ⁱ PERKINELMER INC   (United States)

^j University Malaysia Perlis (UniMAP) Pauh Putra Campus   (Malaysia)

^k Department of Theoretical and Applied Mechanics and the Cornell Nanofabrication Facility   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

BEAMS AND GIRDERS; CHEMICAL VAPOR DEPOSITION; DEFORMATION; MATHEMATICAL MODELS; METALLIZING; MICROELECTRONIC PROCESSING; REACTIVE ION ETCHING; SEMICONDUCTING SILICON; SILICA; SINGLE CRYSTALS; STRAIN MEASUREMENT; THIN FILMS;

ALUMINUM FILMS; COATING FILMS; LINEAR ELASTIC MODEL; METALLIZATION; MICROMECHANICAL CANTILEVER BEAMS; PLANARITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SINGLE CRYSTAL SILICON;

MICROELECTROMECHANICAL DEVICES;

EID: 0030166849     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.506196     Document Type: Article

References (35)

1. W. C. Tang, T. H. Nguyen, and R. T. Howe, "Laterally driven polysilicon resonant microstructures," Sens. Actuators, vol. 20, pp. 25-32, 1889.
2. N. C. MacDonald, L. Y. Chen, J. J. Yao, Z. L. Zhang, J. A. McMillan, and D. C. Thomas, "Selective chemical vapor deposition of tungsten for microelectromechanical structures," Sens. Actuators, vol. 20, pp. 123-133, 1989.
3. P. M. Osterberg, R. K. Gupta, J. R. Gilbert, and S. D. Senturia, "Quantitative models for the measurement of residual stress, Poisson's ratio and Young's modulus using electrostatic pull-in of beams and diaphragms," in Proc. Solid-State Sensor and Actuator Workshop, June 13-16, 1994, pp. 184-188.
4. R. I. Pratt, G. C. Johnson, R. T. Howe, and J. C. Chang, "Micromechanical structures for thin film characterization," in Dig. Tech Papers Transducers 91, Int. Conf. Solid Slate Sensors and Actuators, San Francisco, CA, 1981, pp. 205-208.
5. M. T. A. Saif and N. C. MacDonald, "Design considerations for large MEMS," in Proc. SPIE's Smart Structures and Materials Conf., Feb. 26-Mar. 3, 1995, San Deigo, CA.
6. R. T. Howe and R. S. Muller, "Polycrystalline silicon micromechanical beams," J. Electrochem. Soc., pp. 1420-1423, June 1983.
7. C. Keller and M. Ferrari, "Milli-scale polysilicon structures," in Proc. Solid-State Sensor and Actuator Workshop, Hilton Head, SC, June 13-16, 1994, pp. 132-137.
8. P. Bley, W. Bacher, W. Menz et al., "Description of microstructures in LIGA-technology," Microelectron. Eng., vol. 13, pp. 509-512, 1991.
9. C. Burbaum, J. Mohr, P. Bley et al., "Fabrication of capacitive acceleration sensors by the LIGA technique," Sens. Actuators A, vol. A27, pp. 559-63, 1991.
10. K. Guckel, K. J. Skrobis, T. R. Christenson et al., "Fabrication of assembled micromechanical components via deep X-ray lithography," in Proc. IEEE MEMS 1991, Nara, Japan, pp. 74-79.
11. W. Menz, W. Bacher, W. Harmening et al., "The LIGA technique - A novel concept for microstructures and the combination with Si-technologies by injection moulding," in Proc. IEEE MEMS 1991, Nara Japan, pp. 69-73.
12. Y. X. Li, P. J. French, P. M. Sarro, and R. F. Wolffenbuttel, "Fabrication of a single crystalline silicon capacitive lateral accelerometer using micromachining based on single step plasma etching," in Proc. IEEE Micro Electro Mechanical Systems, Amsterdam, the Netherlands, Jan. 29-Feb. 2, 1995, pp. 398-403.
13. M. de Boer, H. Jansen, and M. Elwenspoek, "The Black silicon method V: A study of the fabricating of movable structures for micro electromechanical systems," in Proc. 8th Int. Conf. Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, June 25-29, 1995, pp. 565-568.
14. Z. L. Zhang and N. C. MacDonald, "An RIE process for submicron, silicon electromechanical structures," J. Micromech. Microeng., vol. 2, pp. 31-38 Mar. 1992.
15. K. A. Shaw, Z. L. Zhang, and N. C. MacDonald, "SCREAM I: A single mask, single-crystal silicon, reactive etching process for microelectroemechanical Structures," Sens. Actuators A, vol. 40, pp. 63-70, 1994.
16. N. C. MacDonald and A. Jazairy, "Single crystal silicon: Application to micro-opto-electromechanical devices," in Proc. SPIE's MicroOptics/Micromechanics and Laser Scanning and Shaping Conf., San Jose, CA, Feb. 7-9, 1995, pp. 125-135.
17. A. Jazairy and N. C. MacDonald, "Very high aspect ratio wafer-free silicon micromechanical structures," in Proc. SPIE's Microlithography and Metrology in Micromachining Conf., Austin, TX, Oct. 23-24, 1995, pp. 111-120.
18. _, "Planar very high aspect ratio microstructures for large loading forces," Microelectron. Eng., vol. 30, pp. 527-530, 1996.
19. Z. L. Zhang and N. C. MacDonald, "Fabrication of submicron highaspect-ratio GaAs actuators," J. Microelectromech. Syst., vol. 2, pp. 66-72, 1993.
20. J. A. Thornton and D. W. Hoffman, "Stress related effects in thin films," Thin Solid Films, vol. 171, no. 1, pp. 5-31, 1989.
21. S. M. Hu, "Stress related problems in silicon technology," J. Appl. Phys., vol. 70., pp. R53-R79, Sept. 1991.
22. [22| S. Wolf and R. N. Tauber, Silicon Processing for the VLSI Era. vol. 1. Sunset Beach, CA: Lattice, 1987, pp. 115.
23. S. Timoshenko and S. Woinowsky-Krieger, Theory of Plates and Shells, 2nd ed. New York: McGraw-Hill, 1959, p. 43.
24. W. A. Brantley, "Calculated elastic constants for stress problems associated with semiconductor devices," J. Appl. Phys., vol. 44, Jan. 1973, pp. 534-535.
25. J. F. Waida, "Characterization of stresses in thin films," Master of Electrical Engineering Project, Cornell University, Itahca, NY, 1992.
26. P. A. Flinn, D. S. Gardner, and W. D. Nix, "Measurement and interpretation of stress in Aluminum-based metallization as a function of thermal history," IEEE Trans. Electron Dev., vol. ED-34, pp. 689-699, Mar. 1987.
27. K. Ozawa, "Mechanical properties of Al and Al alloys and their relationship to interconnection reliability," J. Appl. Phys., vol. 73, pp. 977-985, Jan. 1993.
28. R. P. Vinci and J. C. Bravman, "Mechanical testing of thin films," in Dig. Tech. Papers Transducers '91, Int. Conf. Solid State Sensors and Actuators, 1991, pp. 943-948.
29. R. Venkatraman, J. C. Bravman, W. D. Nix, P. W. Davies, P. A. Flin, and D. B. Fraser, "Mechanical properties and microstructural characterization of Al-.5%Cu thin films," J. Electron. Mater., vol. 19, no. 11, pp. 1231-1237, 1990.
30. E. P. Popov, Mechanics of Materials, 2nd ed. Englewood Cliffs, NJ: Prentice-Hall, 1976.
31. E. Suhir, "Stresses in bi-metal thermostats," J. Appl. Mech., vol. 53, pp. 657-660, Sept. 1986.
32. CRC Handbook of Chemistry and Physics., D. R. Lide, Ed., 75th ed. New York: CRC, 1994
33. I. Ogo and N. C. MacDonald, "Micromechanical structures for electron and ion beam irradiation phenomena," J. Vac. Sci and Technol., vol. B-12, pp. 3285-3288, Nov/Dec. 1994.
34. M. Surendra, C. R. Guarnieri, G. S. Selwyn, and M. Delvie, "Across wafer etch rate uniformity in a high density plasma reactor: Experiment and modeling," Appl. Phys. Lett., vol. 66, pp. 2415-2417, May 1995.
35. M. T. A. Saif and N. C. MacDonald, "A milli Newton micro loading device," in Proc. Transducers 95-Eurosensors IX Conf., Stockholm, Sweden, June 25-29, 1995, pp. 246-A8.