Characterization of microstructure, interfacial reaction and diffusion of immiscible Cu(Ta) alloy thin film on SiO2 at elevated temperature

Journal of the Electrochemical Society

Volumn 151, Issue 1, 2004, Pages

  Liu, C J ^a   Chen, J S ^a   Lin, Y K ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER COMPOUNDS; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; GRAIN GROWTH; INTERFACES (MATERIALS); RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SILICA; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER TANTALUM ALLOY; SUPERSATURATED SOLID SOLUTION;

THIN FILMS;

EID: 0842333171     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1630597     Document Type: Article

References (24)

1. S. P. Murarka, Mater. Sci. Eng., 19, 87 (1997).
2. E. R. Weber, Appl. Phys. A: Solids Surf., 30, 1 (1983).
3. J. D. McBrayer, R. M. Swanson, and T. W. Sigmon, J. Electrochem. Soc., 133, 1242 (1986).
4. S. W. Russell, S. A. Rafalski, R. L. Spreitzer, J. Li, M. Moinpour, F. Moghadam, and T. L. Alford, Thin Solid Films, 262, 154 (1995).
5. J. Li, J. W. Mayer, Y. Shacham-Diamand, and E. G. Colgan, Appl. Phys. Lett., 60 2983 (1992).
6. D. Adams, T. L. Alford, S. A. Rafalski, M. J. Rack, S. W. Russell, M. J. Kim, and J. W. Mayer, Mater. Chem. Phys., 43, 145 (1996).
7. K. Hoshion, H. Yagi, and H. Tsuchikawa, in Proceedings of the 7th International VLSI Multilevel Interconnection Conference, IEEE, p. 357 (1990).
8. C. J. Liu and J. S. Chen, Appl. Phys. Lett., 80, 2678 (2002).
9. C. J. Liu, J. S. Jeng, and J. S. Chen, J. Vac. Sci. Technol. B, 20, 2361 (2002).
10. K. Barmak, G. A. Lucadamo, C. Cabral, Jr., C. Lavoie, and J. N. Harper, J. Appl. Phys., 87, 2204 (2000).
11. M. H. Tsai, S. C. Sun, C. E. Tsai, S. H. Chuang, and H. T. Chiu, J. Appl. Phys., 79, 6932 (1996).
12. M. T. Wang, Y. C. Lin, and M. C. Chen, J. Electrochem. Soc., 145, 2538 (1998).
13. H. J. Lee, K. W. Kwon, C. Ryu, and R. Sinclair, Acta Metall., 47, 3965 (1999).
14. H. Wang, M. J. Zaluzec, and J. M. Rigsbee, Metall. Mater. Trans. A, 28, 917 (1997).
15. J. F. Moulder, W. F. Stickle, P. E. Sobol, and K. D. Bomben, Handbook of X-Ray Photoelectron Spectroscopy, Physical Electronics, Inc., Eden Prairie, MN (1995).
16. J. P. Chu and T. N. Lin, J. Appl. Phys., 85, 6462 (1999).
17. P. R. Subrmanian and D. E. Laughlin, Bull. Alloy Phase Diagrams, 10, 652 (1989).
18. K. T. Miller, F. F. Lange, and D. B. Marshell, J. Mater. Res., 5, 151 (1990).
19. B. D. Cullity and S. R. Stock, Elements of X-Ray Diffraction, 3rd ed., p. 170, Prentice Hall, New Jersey (2001).
20. T. Nemoto and T. Nogami, in Proceedings of the 32nd Symposium on Reliability Physics, IEEE, p. 207 (1994).
21. G. E. McGuire, G. K. Schweitzer, and T. A. Carlson, Inorg. Chem., 12, 2450 (1973).
22. S. Lecuyer, A. Quemerais, and G. Jezequel, Surf. Interface Anal., 18, 257 (1992).
23. D. R. Gaskell, Introduction to the Thermodynamics of Materials, 3rd ed., Chap. 13, Taylor & Francis, Washington, D.C. (1995).
24. I. Brain, Thermochemical Data of Pure Substances, 3rd ed., VCH, Weinheim (1995).