Formation of passivation and adhesion layers for Cu via nitridation of Cu-Ti in an ammonia ambient

Materials Chemistry and Physics

Volumn 43, Issue 2, 1996, Pages 145-152

  Adams, Daniel ^a   Alford, T L ^a   Rafalski, S A ^a   Rack, M J ^b   Russell, S W ^a   Kim, M J ^a   Mayer, J W ^a  

^a ARIZONA STATE UNIVERSITY   (United States)

^b Arizona State University   (United States)

Author keywords

Adhesion properties; Copper; Nitridation; Passivation layer; Titanium nitride

Indexed keywords

ADHESION; AMMONIA; ANNEALING; CHEMICAL REACTIONS; COPPER ALLOYS; FILM GROWTH; NITRIDING; PASSIVATION; SEGREGATION (METALLOGRAPHY); STABILITY; STRUCTURE (COMPOSITION); TITANIUM;

ADHESION LAYER; COPPER TITANIUM ALLOYS; INTERFACIAL REACTIONS; NITRIDATION; PASSIVATION LAYER; SCRATCH TEST;

COPPER;

EID: 0030084824     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/0254-0584(95)01610-7     Document Type: Article

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