Residual stress effect on performance of diaphragm-based MEMS pressure transducers

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AB, Issue , 2000, Pages 269-274

  Niu, Meng Nian ^a   Kim, Eun Sok ^a,b  

^a University of Hawaii at Manoa   (United States)

^b UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; MICROPHONES; RESIDUAL STRESSES;

COMPRESSIVE RESIDUAL STRESS; LAYER BY LAYER; LAYER THICKNESS; PARYLENES; PERFORMANCE; PIEZOELECTRIC MICROPHONES; RESIDUAL STRESS EFFECTS;

DIAPHRAGMS;

EID: 0742328821     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1102     Document Type: Conference Paper

References (12)

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