Partially etched holes for residual stress release in diaphragm-based pressure sensors

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AB, Issue , 2000, Pages 227-232

  Niu, Meng Nian ^a   von Preissig, Fred J ^a   Kim, Eun Sok ^a,b  

^a University of Hawaii at Manoa   (United States)

^b UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROPHONES; RESIDUAL STRESSES;

ACOUSTIC SENSITIVITY; ETCHED HOLES; FILM LAYERS; HOLE ARRAYS; HOLE SIZE; LAYER STRUCTURES; PARYLENES; PIEZOELECTRIC MICROPHONES; SQUARE HOLES; STRESS RELEASE;

DIAPHRAGMS;

EID: 0742293623     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1096     Document Type: Conference Paper

References (5)

1. Jerman, J. H., 1990, "The Fabrication and Use of Micromachined Corrugated Silicon Diaphragms," Sensors and Actuators A, vol.21-23, pp.988-992.
2. Niu, M. N., Zeng, H., Yan, H., and Kim, E. S., 1999, "Extensive Experimental Study on Diaphragm-based Piezoelectric Microphone," Proceedings, ASME International Mechanical Engineering Congress and Exposition, Symposium on Microelectromechanical Systems, Nashville, TN, USA, MEMS-Vol. 1, pp. 209-213.
3. Niu, M. N., and Kim, E. S., 2000, "Residual Stress Effect on Performance of Diaphragm-Based MEMS Pressure Transducers," Proceedings, ASME International Mechanical Engineering Congress and Exposition, Symposium on Microelectromechanical Systems, Orlando, FL, USA.
4. Scheeper, P. R., Olthuis, W., and Bergveld, P., 1994, "The Design, Fabrication, and Testing of Corrugated Silicon Nitride Diaphragms," J. Microelectromechanical System, vol. 3, pp.36-42.
5. Yan, H., Lou, K. C, Lee, B. C, and Kim, E. S., 1998, "Analysis on Multi-layered, Corrugated Diaphragm with Residual Stress," Proceedings, ASME International Mechanical Engineering Congress and Exposition, Symposium on Microelectromechanical Systems, Anaheim, CA, USA, pp. 373-378.