EXTENSIVE EXPERIMENTAL STUDY ON DIAPHRAGM-BASED PIEZOELECTRIC MICROPHONE

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1999-W, Issue , 1999, Pages 209-213

  Niu, Meng Nian ^a   Zeng, Hong ^a   Yan, Hai ^a   Kim, Eun Sok ^a  

^a University of Hawaii at Manoa   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; DIAPHRAGMS; II-VI SEMICONDUCTORS; PIEZOELECTRICITY; RESIDUAL STRESSES; SILICON NITRIDE; ZINC OXIDE;

ACOUSTIC CHAMBER; ACTIVE AREA; BENDING CURVATURE; INSULATING LAYERS; LOWER STRESS; MICRO-MACHINED; PIEZOELECTRIC; PIEZOELECTRIC MICROPHONES; SILICON SUBSTRATES; VERTICAL DISPLACEMENTS;

MICROPHONES;

EID: 85120007669     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1999-0269     Document Type: Conference Paper

References (12)

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