Expanding thermal plasma for low-k dielectrics deposition

Materials Research Society Symposium - Proceedings

Volumn 766, Issue , 2003, Pages 339-344

  Creatore, M ^a   Barrell, Y ^a   Kessels, W M M ^a   Van De Sanden, M C M ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELASTIC MODULI; ELECTRIC CONDUCTIVITY OF SOLIDS; ELLIPSOMETRY; HARDNESS; INDENTATION; MECHANICAL VARIABLES MEASUREMENT; PERMITTIVITY; PLASMA APPLICATIONS; PRESSURE EFFECTS; SILICA; ULSI CIRCUITS;

EXPANDING THERMAL PLASMA; HEXAMETHYLDISILOXANE; NANOINDENTATION; PRESSURE DIFFERENCE; SPECTROSCOPIC ELLIPSOMETRY;

DIELECTRIC FILMS;

EID: 0347569340     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-766-e6.9     Document Type: Conference Paper

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