A model of low-temperature wafer bonding and its applications

Journal of the Electrochemical Society

Volumn 143, Issue 5, 1996, Pages 1773-1779

  Tong, Q Y ^a   Gosele U ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BOND STRENGTH (MATERIALS); COOLING; HEATING; LOW TEMPERATURE OPERATIONS; MODELS; PEELING; SILICON WAFERS; STRESS ANALYSIS; THERMAL STRESS;

IMPLANTED CARBON ETCH STOP; LOW TEMPERATURE WAFER BONDING; ULTRATHIN SILICON ON INSULATOR LAYERS;

BONDING;

EID: 0030142641     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836715     Document Type: Article

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