Failure prediction in plastic ball grid array electronic packaging

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 469-473

  Yeh, Meng Kao ^a   Chang, Kuo Chin ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347032772     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)

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