Ball grid array thermomechanical response during reflow assembly

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 4, 1996, Pages 214-222

  Voth, T E ^a   Bergman, T L ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; HEAT CONDUCTION; MECHANICAL PROPERTIES; NUMERICAL ANALYSIS;

BALL GRID ARRAY; THERMOMECHANICAL RESPONSE;

SOLDERING;

EID: 0030405082     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792155     Document Type: Article

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