Impact of die attach material and substrate design on RF GaAs power amplifier devices thermal performance

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 589-596

  Chiriac, Victor Adrian ^a   Lee, Tien Yu Tom ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; HEAT RESISTANCE; POWER AMPLIFIERS; SEMICONDUCTING GALLIUM ARSENIDE; SOLDERING; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMOANALYSIS;

DIE ATTACH MATERIAL; GALLIUM ARSENIDE DEVICE; RADIO FREQUENCY POWER AMPLIFIER DEVICE;

ELECTRONICS PACKAGING;

EID: 0346936433     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604804     Document Type: Article

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