A comparison of thermal stress/strain behavior of ellipse/round solder pads

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 413-418

  Chiang, Kuo Ning ^b   Cheng, Hsien Chie ^a   Liu, Chang Ming ^b  

^a NATIONAL CENTER FOR HIGH PERFORMANCE COMPUTING   (Taiwan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345771704     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)

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4. Liedtke, P.E., 1993, "Prediction of Solder Joint Geometry in Surface Mount Technology - An Analytical Approach", P.h.D. Thesis, Marquette University, Milwaukee, WI.
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9. nd ed., Electrochemical Publications Limited, Scotland.
10. Guenin, B. M., Marrs, R. C., and Molnar, R. J., 1995, "Analysis of a Thermally Enhanced Ball Grid Array Package", IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 18, No. 4, pp. 749-757.
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