Parametric analysis of thermally enhanced BGA reliability using a finite-volume-weighted averaging technique

American Society of Mechanical Engineers, EEP

Volumn 24, Issue , 1998, Pages 13-20

  Cheng, Hsien Chie ^a   Chiang, Kuo Ning ^a   Chen, Chao Kuang ^a  

^a NATIONAL CENTER FOR HIGH PERFORMANCE COMPUTING   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FINITE VOLUME METHOD; SOLDERED JOINTS; STRAIN; THERMAL EFFECTS;

THERMALLY ENHANCED BALL GRID ARRAYS (TEBGA);

ELECTRONICS PACKAGING;

EID: 0032314223     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)