Thermal fatigue model for surface mount leadless chip resistor (LCR) solder joints

American Society of Mechanical Engineers, EEP

Volumn 17, Issue , 1996, Pages 1-12

  Pao, Y H ^a   Jih, E ^a   Siddapureddy, V ^a   Song, X ^a   Liu, R ^a   McMillan, R ^a   Hu, J M ^a  

^a FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; RESISTORS; SCANNING ELECTRON MICROSCOPY; STRAIN; STRESSES; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

LEADLESS CERAMIC CHIP CARRIER; LEADLESS CHIP CAPACITOR; LEADLESS CHIP RESISTOR; NONLINEAR FINITE ELEMENT MODELLING; THERMAL CYCLIC STRESSES;

SOLDERED JOINTS;

EID: 0030392446     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)