On enhancing eutectic solder joint reliability using a 2nd-reflow-process approach

American Society of Mechanical Engineers, EEP

Volumn 24, Issue , 1998, Pages 21-25

  Chiang, Kuo Ning ^a   Cheng, Hsien Chie ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SOLDERED JOINTS; SOLDERING ALLOYS;

BALL GRID ARRAYS (BGA); THREE-DIMENSIONAL SOLDER LIQUID FORMULATION MODELS;

ELECTRONICS PACKAGING;

EID: 0032318458     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)