Creep behavior of BGA solder joints during thermal cycling by Moire Interferometry

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 685-691

  Zhao, Y ^a   Dishongh, T ^b   Cartwright, A ^a   Basaran, C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345771601     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)

1. Basaran, C. and Chandaroy, R., "Mechanics of Pb40/Sn60 Near Eutectic Solder Alloys Subjected to Vibrations", Applied Mathematical Modeling, 22, 601-627, 1998.
2. Basaran, C. and Chandaroy, R., "Using FEM for Simulation of Reliability Tests on Solder Joints in Microelectronic Packaging", Computer & Structures, in print, 1999.
3. Bonda, N.R., and Noyan, I.C., "Effect of the Specimen Size In Predicting the Mechanical Properties of PbSn Solder Alloys," Trans. Comp. Pack. And Man., Tech. A 19 (2)
4. Frear, D.R., Jones, W.B. and Kinsman, K.R. Solder Mechanics, State Of The Art Assessment, Santan Fe, New Mexico, 1990.
5. Guo, Y. "Experimental Determination Of Effective Coefficients Of Thermal Expansion In Electronic Packaging", EEP-Vol. 10-2, Advances In Electronic Packaging, ASME 1995, p. 1253-1264.
6. Han, B. and Guo, Y. "Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry", Journal of Electronic Packaging, Sep. 1995, Vol. 117, p.185-191.
7. Han, B. and Guo, Y. "Determination of an Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-Field Approach", IEEE Transactions on Components, Packaging, and Manufacturing Technology- Part A, Vol. 19, No.2, June, 1996, p.240-247.
8. Han, B. "Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study", Journal of Electronic Packaging, Sep. 1997, Vol. 119, p.189-196.
9. Post, D., Han, B. and Ifju, P. High Sensitivity Moiré, Springer-Verlag, 1994.
10. Post, D., Dai, F.L. , Guo, Y. and Ifju, P. "Interlaminar Shear Moduli of Cross Laminates: An Experimental Analysis", Journal of Composite Materials, Vol. 23, March 1989, p.265-279
11. Markstein, H. W. "Designing Electronics for High Vibration and Shock", Electronic Packaging & Production, April, 1987, p.40-43.
12. Morris, Jr. J.W. and Reynolds, H.L. "The Influence Of Microstructure On The Mechanics Of Eutectic Solders", EEP Vol. 19-2, Advances in Electronic Packaging, ASME, 1991, p. 1529.
13. Verma, K., Kunthong, P. and Han, B. "Thermo-Mechanical Strains Of Flip-Chip Solder Bumps On Organic PCB Substrate", ASME International Mechanical Congress & Exposition, Anahein, California, Nov. 15-20, 1998.
14. Wang, J., Qian, Z., Zou, D, and Liu, S. "Creep Behavior of a Flip-Chip Package By Both FEM Modeling And Real Time Moiré Interferometry", Journal of Electronic Packaging, June 1998, Vol. 120, p.179-185.
15. Zhu, J. and Liu, S., "Thermal Deformation And Stress Analysis Of A Column Grid Array Package By Hybrid Moiré/FEM Method", ASME International Mechanical Engineering Congress & Exposition, Dallas, Texas, Nov. 16-21, 1997.