Thermal deformation and stress analysis of a column grid array package by hybrid moire/FEM method

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1997, Pages

  Zhu, Jiansen ^a   Liu, Sheng ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; DEFORMATION; FINITE ELEMENT METHOD; INTERFEROMETRY; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; STRESS ANALYSIS;

COLUMN GRID ARRAY (CGA); MOIRE INTERFEROMETRY; THERMAL DEFORMATION;

ELECTRONICS PACKAGING;

EID: 0031333227     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)