Thermo-mechanical strains of flip-chip solder bumps on organic PCB substrate

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1998, Pages 1-9

  Verma, K ^a   Kunthong, P ^a   Han, B ^a  

^a CLEMSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTERFEROMETRY; PRINTED CIRCUIT BOARDS; SHEAR DEFORMATION; STRAIN; SUBSTRATES; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES;

COEFFICIENT OF THERMAL EXPANSION; SHEAR STRAIN;

ELECTRONICS PACKAGING;

EID: 0032278145     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)