Oxidation and reduction kinetics of eutectic SnPb, InSn and AuSn: A knowledge base for fluxless solder bonding applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 120-126

  Kuhmann, J F ^a   Preuss, A ^a   Adolphi, B ^a   Maly, K ^a   Wirth, T ^a   Oesterle, W ^a   Pittroff, W ^a   Weyer, G ^a   Fanciulli, M ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; EUTECTICS; FLIP CHIP DEVICES; GOLD ALLOYS; INDIUM ALLOYS; OXIDATION; OXIDES; REACTION KINETICS; REDUCTION; TIN ALLOYS; WETTING;

FLIP CHIP (FC) BONDING;

SOLDERING ALLOYS;

EID: 0030681517     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)