SCOPUS 정보 검색 플랫폼

Volumn 86, Issue 3, 1999, Pages 1196-1201

Spectroscopic measurement of packaging-induced strains in quantum-well laser diodes

(12) Tomm, J W a Muller R a Barwolff A a Elsaesser, T a Gerhardt, A b Donecker, J b Lorenzen, D c Daiminger, F X c Weiss S d Hutter, M d Kaulfersch, E d Reichl, H d

a MAX BORN INSTITUT (Germany)

b LEIBNIZ INSTITUTE FOR CRYSTAL GROWTH (Germany)

c JENOPTIK Laserdiode GmbH (Germany)

d Fraunhofer Einrichtung F Z (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CLADDING (COATING); COMPUTATIONAL METHODS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FOURIER TRANSFORMS; HEAT SINKS; LIGHT ABSORPTION; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; PHOTOCURRENTS; STRAIN; THERMAL EXPANSION;

NONINVASIVE OPTICAL METHODS; PACKAGING-INDUCED STRAINS; STRAINED LASER ARRAYS;

QUANTUM WELL LASERS;

EID: 0344183011 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.370870 Document Type: Article

Times cited : (27)

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