Design, simulation and technological realization of a reliable packaging concept for high power laser bars

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1395-1401

  Weiss, S ^a   Kaulfersch, E ^a   Topfer, M ^b   Aschenbrenner, R ^a   Michel, B ^a   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BARS (METAL); HIGH POWER LASERS; NETWORK COMPONENTS; BONDING; COMPUTER SIMULATION; FAST FOURIER TRANSFORMS; FINITE ELEMENT METHOD; HEAT RESISTANCE; HEAT SINKS; PRODUCT DESIGN;

BONDING STRESS; ELECTRO-OPTICAL CHARACTERIZATIONS; FAST FOURIER TRANSFORMATIONS; FEM SIMULATIONS; MAXIMUM POWER; TECHNOLOGICAL LIMITATIONS; THERMAL SIMULATIONS; THERMO-MECHANICAL DESIGN; HIGH POWER LASER BARS; THERMOMECHANICAL DESIGN;

LASER BEAMS; ELECTRONICS PACKAGING;

EID: 0031635343     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678926     Document Type: Conference Paper

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