A study of platinum electrode patterning in a reactive ion etcher

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 3, 1998, Pages 1489-1496

  Chang, Li Hsin ^a   Apen, Elizabeth ^a   Kottke, Mike ^a   Tracy, Clarence ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHAMBER CLEANING; ETCH CHEMISTRY; ETCH PROCESS; ETCH RATES; ETCH UNIFORMITY; ETCHING CHARACTERISTICS; GAS FLOWS; PATTERNED FILMS; PLATINUM ELECTRODES; PT ELECTRODE; REACTIVE ION; REACTIVE ION ETCH; REDEPOSITION; REMOVAL RATE; SAFETY ISSUES; SURFACE CLEANLINESS; WAFER CLEANING;

AUGER ELECTRON SPECTROSCOPY; CLEANING; ELECTRON BEAM LITHOGRAPHY; PLATINUM; REACTIVE ION ETCHING;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 0342958206     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581175     Document Type: Article

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