Study of residual stress on rf reactively sputtered RuO2 thin films

Thin Solid Films

Volumn 375, Issue 1-2, 2000, Pages 29-32

  Meng, Li Jian ^a   Dos Santos, M P ^b  

^a INSTITUTO SUPERIOR DE ENGENHARIA DO PORTO   (Portugal)

^b UNIVERSITY OF MINHO   (Portugal)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ORIENTATION; FILM PREPARATION; GLASS; MAGNETRON SPUTTERING; RAMAN SCATTERING; RESIDUAL STRESSES; RUTHENIUM COMPOUNDS; SPUTTER DEPOSITION; SUBSTRATES; THERMAL EFFECTS; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

RADIO FREQUENCY REACTIVE MAGNETRON SPUTTERING;

CONDUCTIVE FILMS;

EID: 0342538899     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(00)01174-3     Document Type: Article

References (23)

1. Kolawa E., So F.C.T., Pan E.T.-S., Nicolet M.-A. Appl. Phys. Lett. 50:1987;854.
2. Takemura K., Sakuma T., Miyasaka Y. Appl. Phys. Lett. 64:1994;2967.
3. Al-Shareef H.N., Bellur K.R., Kingon A.I., Auciello O. Appl. Phys. Lett. 66:1995;239.
4. Al-Shareef H.N., Bellur K.R., Auciello O., Kingon A.I. Thin Solid Films. 256:1995;73.
5. Elbaum L.K., Wittmer M., Yee D.S. Appl. Phys. Lett. 50:1987;1879.
6. Butler S.R., Gillson J.L. Mater. Res. Bull. 6:1971;81.
7. Ryden W.D., Lawson A.W., Sartain C.C. Phys. Rev. B. 1:1970;1494.
8. Goel A.K., Skorinko G., Pollak F.H. Phys. Rev. B. 24:1981;7342.
9. Kolawa E., So F.C.T., Flick W., Zhao X.-A., Pan E.T-S., Nicolet M-A. Thin Solid Films. 173:1989;217.
10. Vijav D.P., Desu S.B. J. Electrochem. Soc. 140:1993;2640.
11. Liao P.C., Mar S.Y., Ho W.S., Huang Y.S., Tiong K.K. Thin Solid Films. 287:1996;74.
12. Elbaum L.K. Thin Solid Films. 169:1989;17.
13. Bai G.-R., Wang A., Foster C.M., Vetrone J. Thin Solid Films. 310:1997;75.
14. Meng L.-J., Fortunato E., Nunos R., dos Santos M.P. J. Korean Phys. Soc. 32:1998;S1835.
15. Meng L.-J., dos Santos M.P. Appl. Surf. Sci. 147:1999;94.
16. Patil P.S., Ennaoui E.A., Lokhande C.D., Muller M., Giersig M., Diesner K., Tributsch H. Thin Solid Films. 310:1997;57.
17. Hong S.K., Kim H.J., Yang H.G. J. Appl. Phys. 80:1996;822.
18. Exarhos G.J., Hess N.J. Thin Solid Films. 220:1992;254.
19. Kim J.G., Yu J. J. Mater. Res. 13:1998;3027.
20. Powder Diffraction File, Joint Committee on Powder Diffraction Standards, 1967 (ASTM, Philadelphia, PA, 1967), Card 43-1027.
21. Noyan I.C. Residual Stress. 1987;Springer, New York, Berlin, Heidelberg.
22. Mar S.Y., Chen C.S., Huang Y.S., Tiong K.K. Appl. Surf. Sci. 90:1995;497.
23. Parker J.C., Siegel R.W. J. Mater. Res. 5:1990;1246.