Flip-chip assembly for RF and optical MEMS

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Zhang, Wenge ^a   Harsh, Kevin F ^a   Michalicek, M Adrian ^a   Bright, Victor M ^a   Lee, Y C ^a  

^a University of Colorado   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CAPACITORS; CERAMIC MATERIALS; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; MIRRORS; OPTOELECTRONIC DEVICES; SILICON; SUBSTRATES;

OPTICAL INTEGRATION;

FLIP CHIP DEVICES;

EID: 0342298375     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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