Effect of Electroless Nickel/Immersion Gold Finishing on BGA Solder Joints

journal of the japan institute of electronics packaging

Volumn 4, Issue 2, 2004, Pages 124-127

  Sugizaki, Takashi ^a   Tajima, Kazutaka ^a   Sasaki, Tadashi ^a   Nakao, Hidehiro ^a   Fukuda, Yutaka ^a   Kimura, Takashi ^b  

^a Meltex Ltd   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

BGA; Electroless Nickel; Immersion Gold; Solder

Indexed keywords

EID: 85009648632     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.4.124     Document Type: Article

References (0)