Effect of Cu Addition on Properties of Sn-Ag Lead Free Solder

Journal of Japan Institute of Electronics Packaging

Volumn 3, Issue 2, 2000, Pages 132-135

  Shimoyashiki, Kazuo ^a   Kitazawa, Nobuaki ^a   Watanabe, Yoshihisa ^a   Nakamura, Yoshikazu ^a  

^a NATIONAL DEFENSE ACADEMY   (Japan)

Author keywords

Bi Addition; Cu Addition; Lead Free Solder; Sn Ag Solder

Indexed keywords

EID: 0038446154     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.3.132     Document Type: Article

References (3)

1. P. T. Vianco, and D. R. Frear: “Issues in the Replacement of Lead-Bearing Solders”, JOM, Vol. 45. No. 7, pp. 14-19, 1993.
2. M. Mccormack, and S. Jin: “Progress in the Design of New Lead-Free Solder Alloy”, JOM, Vol. 45. No. 7, pp. 36-40, 1993.
3. Y. Nakamura, Y. Sakakibara, Y. Watanabe, and Y. Amamoto: “Microstructure of Solder Joints with Electoronic Components in Lead-Free Solders”, Soldering & Surface Mount Technology, Vol. 10. No. 1, pp. 10-12, 1998.