Comparison of BGA Jointing Property of Sn-Ag and Sn-Ag-Cu Solder Balls on EN/IG Finished Boards

journal of the japan institute of electronics packaging

Volumn 5, Issue 3, 2002, Pages 272-277

  Sugizaki, Takashi ^a   Sano, Akitoshi ^a   Nakao, Hidehiro ^a   Fukuda, Yutaka ^a   Kimura, Takashi ^b  

^a Meltex Ltd   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

BGA; Elect roless Nickel; Immersion Gold; Lead Free Solder; Sn Ag; Sn Ag Cu

Indexed keywords

EID: 85009557049     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.5.272     Document Type: Article

References (4)

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2. M. McCormack and S. Jin: “Progress in the Design of New Lead-Free Solder Alloy”, the journal of the Minerals, Metals & Materials Society, Vol. 45, No. 7, pp. 36-40, 1993.
3. M. Singleton and P. Nash: “Ag-Ni(Silver-Nickel)”, BINARY ALLOY PHASE DIAGRAMS-Second edition-, Vol. 1, pp. 64-66.
4. D. S. Bright and D. E. Newbury: “A Scatter Diagram Technique for Viewing Two or Three Related Images”, Analytical Chemistry, Vol. 63, pp. 243A-250A, 1991.