The Trend of Bonding Technology for CSP & FC

Journal of Japan Institute of Electronics Packaging

Volumn 2, Issue 3, 1999, Pages 236-242

  Sakemi, Shoji ^a   Noda, Kazuhiro ^a  

^a R and D Lab   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038106884     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.2.236     Document Type: Article

References (1)

1. N. G. Koopman, T. C. Reirey, and P. A. Totta: “Microelectronics Packaging Handbook” BP, 1991