Suppression of Cu agglomeration in the Cu/Ta/Si structure by capping layer

Science and Technology of Advanced Materials

Volumn 4, Issue 4, 2003, Pages 391-396

  Lim, J W ^a   Mimura, K ^a   Isshiki, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Agglomeration; Copper; Ion beam deposition; Resistivity

Indexed keywords

AGGLOMERATION; ANNEALING; ION BEAM ASSISTED DEPOSITION; METALLIZING; NUCLEATION; SILICA; SUBSTRATES; THERMAL EXPANSION; X RAY DIFFRACTION ANALYSIS;

CAPPING LAYERS;

COPPER;

EID: 0242657746     PISSN: 14686996     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1468-6996(03)00067-6     Document Type: Article

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