Electrodeposition of adherent copper film on unmodified tungsten

Thin Solid Films

Volumn 445, Issue 1, 2003, Pages 72-79

  Wang, Chen ^a   Lei, Jipu ^a   Bjelkevig, Cameron ^a   Rudenja, Sergei ^a   Magtoto, Noel ^a   Kelber, Jeff ^a  

^a UNIVERSITY OF NORTH TEXAS   (United States)

Author keywords

Copper; Electrochemistry; Nucleation; Tungsten

Indexed keywords

COPPER; ELECTRODEPOSITION; ELECTROLYTES; ENERGY DISPERSIVE SPECTROSCOPY; NUCLEATION; PH EFFECTS; POLYCRYSTALLINE MATERIALS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

SCOTCH TAPE TEST;

THIN FILMS;

EID: 0242366729     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)01239-2     Document Type: Article

References (28)

1. Semiconductor Industry Association Roadmap, Semiconductor Industry Association, San Jose, CA, 1999.
2. Edelstein D., Heidenreich J., Goldblatt R., Cote W., Uzoh C., Lustig N., Roper P., McDevitt T., Motsiff W., Simon A., Dukovic J., Wachnik R., Rathore H., Schulz R., Su L., Luce S., Slattery J. Proc. IEEE Intern. Electron. Devices Meet. 43:1997;773.
3. Chen L., Magtoto N., Ekstrom B., Kelber J. Thin Solid Films. 376:2001;115.
4. Ekstrom B.M., Lee S., Magtoto N.P., Kelber J.A. Appl. Surf. Sci. 171:2001;275.
5. Peden C.H.F., Lu H.C., Shinn N.D. J. Vac. Sci. Technol. A. 9:1991;1518.
6. Oskam G., Vereecken P.M., Searson P.C. J. Electrochem. Soc. 146:1999;1436.
7. Radisic A., West A.C., Searson P.C. J. Electrochem. Soc. 149:2002;C94.
8. Hoffmann P.M., Radisic A., Searson P.C. J. Electrochem. Soc. 147:2000;2576.
9. Martínez-Ruiz A., Valenzuela-Benavides J., d. l. Garza L.M., Batina N. Surf. Sci. 476:2001;139.
10. Stuve E.M., Rogers J.W. Jr, Ingersoll D., Goodman D.W., Thomas M.L. Chem. Phys. Lett. 149:1988;557.
11. Cao Y., West A.C. J. Electroanal. Chem. 514:2001;103.
12. Pricer T.J., Kushner M.J., Alkire R.C. J. Electrochem. Soc. 149:2002;C396.
13. Pricer T.J., Kushner M.J., Alkire R.C. J. Electrochem. Soc. 149:2002;C406.
14. Wu Z.-L., Yau S.-L. Langmuir. 17:2001;4627.
15. Endres F., Schweizer A. Phys. Chem. Chem. Phys. 2:2000;5455.
16. Broekmann P., Wilms M., Spaenig A., Wandelt K. Prog. Surf. Sci. 67:2001;59.
17. Wang C., Lei J., Rudenja S., Magtoto N., Kelber J. Electrochem. Solid State Lett. 5:2002;C82.
18. Jones F.H., Egdell R.G., Brown A., Wondre F.R. Surf. Sci. 374:1997;80.
19. Gulino A., Parker S., Jones F.H., Egdell R.G. J. Chem. Soc., Faraday Trans. 92:1996;2137.
20. G.A. d. Wijs, P.K. d. Boer, R.A. d. Groot, G. Kresse, Phys. Rev. B: Condens. Matter Mater. Phys. 59 2684.
21. Hanna A.A., Khilla M.A. Thermochim. Acta. 65:1983;311.
22. Pourbaix M. Atlas of Electrochemical Equilibria in Aqueous Solutions. 1966;Pergammon Press, New York.
23. Wilms M., Broekmann P., Stuhlmann C., Wandelt K. Surf. Sci. 416:1998;121.
24. Li W.-H., Nichols R.J. J. Electroanal. Chem. 456:1998;153.
25. Bard A., Faulkner L. Electrochemical Methods. 1980;John Wiley and Sons, New York.
26. Gunawardena G., Hills G.J., Montenegro I., Scharifker B. J. Electroanal. Chem. 138:1982;225.
27. Scharifker B.R., Hills G.H. Electrochim. Acta. 28:1983;879.
28. Kodambaka S., Petrova V., Vailionis A., Desjardins P., Cahill D.G., Petrov I., Greene J.E. Thin Solid Films. 392:2001;164.