Seedless electrodeposition of Cu on unmodified tungsten

Electrochemical and Solid-State Letters

Volumn 5, Issue 9, 2002, Pages

  Wang, Chen ^a   Lei, Jipu ^a   Rudenja, Sergei ^a   Magtoto, Noel ^a   Kelber, Jeff ^a  

^a UNIVERSITY OF NORTH TEXAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; CRYSTAL GROWTH; NUCLEATION; PH EFFECTS; POLYCRYSTALLINE MATERIALS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SULFURIC ACID; TUNGSTEN; X RAY PHOTOELECTRON SPECTROSCOPY;

DENDRITIC GROWTH; INTERFACIAL OXIDE; SCOTCH TAPE TEST; SILVER CHLORIDE;

ELECTRODEPOSITION;

EID: 0036714841     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1498015     Document Type: Article

References (10)