Control of the Reactive Sputtering Process Using Two Reactive Gases

Proceedings, Annual Technical Conference - Society of Vacuum Coaters

Volumn , Issue , 2003, Pages 98-103

  Sproul, W D ^a   Christie, D J ^a   Carter, D C ^a   Berg, S ^b   Nyberg, T ^b  

^a Advanced Energy Industries Incorporated   (United States)

^b UPPSALA UNIVERSITY   (Sweden)

Author keywords

Partial pressure control; Reactive deposition; Sputter deposition; Vacuum system instrumentation and control

Indexed keywords

COMPOSITION; FEEDBACK CONTROL; HYSTERESIS; PARTIAL PRESSURE; PRESSURE CONTROL;

REACTIVE SPUTTERING;

SPUTTER DEPOSITION;

EID: 0242353775     PISSN: 07375921     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. rd International Conference on Microelectronics and Interfaces, Santa Clara, CA, p. 127, February 11-14, 2002.
2. W. D. Sproul and B. E. Sylvia, "Multi-Level Control for Reactive Sputtering," 45th Annual Technical Conference Proceedings of the Society of Vacuum Coaters, Orlando, FL, p. 11, April 2002.
3. J. Schulte and G. Sobe, "Magnetron Sputtering of Aluminum Using Oxygen or Nitrogen as Reactive Gas," Thin Solid Films, 324, 19, 1998.
4. J. Baborowski, M. Charbonnier, and M. Romand, "Effect of the Nature of the Working Gas on the D.C. Sputter Deposition of Chromium Nitride and Ox-Nitride Thin Films on Steel Substrates," Surface and Coatings Technology, 80, 190, 1996.
5. M. Serényi, M. Rácz, and T. Lohner, "Refractive Index of Sputtered Silicon Oxynitride Layers for Antireflection Coating," Vacuum, 61, 245, 2001.
6. P. Carlsson, C. Nender, H. Barankova, and S. Berg, "Reactive Sputtering Using Two Reactive Gases, Experiments and Computer Modeling," J. Vac. Sci. Technol. A, 11(4), 1534, 1993.
7. H. Barankova, S. Berg, P. Carlsson, and C. Nender, "Hysteresis Effects in the Sputtering Process Using Two Reactive Gases," Thin Solid Films, 260, 181, 1995.
8. S. Berg and C. Nender, "Modeling of Mass Transport and Gas Kinetics of the Reactive Sputtering Process," Journal de Physique IV, Colloque C5, supplément au Journal de Physique II, 5, C5/45, 1995.
9. N. Martin and C. Rousselot, "Instabilities of the Reactive Sputtering Process Involving One Metallic Target and Two Reactive Gases," J. Vac. Sci. Technol. A, 17(5), 2869, 1999.
10. N. Martin and C. Rousselot, "Influence of Two Reactive Gases on the Instabilities of the Reactive Sputtering Process," Surface and Coatings Technology, 142, 206, 2001.
11. N. Martin, R. Sanjinés, J. Takadoum, and F. Lévy, "Enhanced Sputtering of Titanium Oxide, Nitride, and Oxynitride Thin Films by the Reactive Gas Pulsing Technique," Surface and Coatings Technology, 142, 615, 2001.
12. N. Martin, O. Banakh, A. M. E. Santo, S. Springer, R. R. Sanjinés, J. Takadoum, and F. Levy, "Correlation between Processing and Properties of TiNxOy Thin Films Sputter Deposited by the Reactive Gas Pulsing Technique," Applied Surface Science, 185, 123, 2001.
13. S. Berg, T. Nyberg, and W. D. Sproul, "A Study of the Reactive Sputtering Process with Two Reactive Gases," to be submitted for publication to Surface and Coatings Technology.