SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 32, Issue 10, 2003, Pages 994-999

TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnects

(5) Wang, H a Gupta, A a Tiwari, Ashutosh a Zhang, X b Narayan, J a

a North Carolina State University (United States)

b LOS ALAMOS NATIONAL LABORATORY (United States)

Author keywords

Alloy; Cu diffusion barrier; Superlattice; TaN; TiN

Indexed keywords

BINARY ALLOYS; DIFFUSION IN SOLIDS; FILM GROWTH; PULSED LASER DEPOSITION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SUPERLATTICES; TANTALUM ALLOYS; THIN FILMS; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

BINARY COMPONENT FILMS; DIFFUSION BARRIERS; TANTALUM NITRIDE;

COPPER;

EID: 0242304973 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-003-0081-7 Document Type: Article

Times cited : (11)

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